Glass Laser Cutting & Breaking Machine

Product Features:

Cutting and breaking integration, high precision, high efficiency, high quality, fast speed, environmentally friendly without consumables, high degree of automation and intelligence;
Widely used in the cutting of glass products in industries such as home appliance,electronic,construction and decoration, automotive, photovoltaic, medical and scientific research.

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Product Overview

A non-contact precision processing equipment developed for glass substrates (especially brittle, ultra-thin or irregular glass), based on the collaborative technology of “laser marking mechanical fracture”, can accurately cut and mark the glass path and achieve one-time neat fracture on a single device, without the need for subsequent edge grinding or secondary processing. It is widely used in efficient molding and processing scenarios for electronic glass (such as OLED display panel glass, consumer electronics cover glass), photovoltaic glass, automotive glass and special optical glass.

Product Parameters

Laser:Infrared

Glass thickness range:0.1-20mm

Overall size:2600*2200*2300mm

Cutting linear speed (thickness 2mm)：800mm/s

Accuracy:≤0.02mm

Working size:1000*800mm

Weight：3500KG

Power：12KW

Application Areas & Scenarios

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